Sunshine SS-101A IC Glue Removing Tools

Features:

• Elasticity is tougher, high-temperature resistance, no deformation, no sticky tin
• Using this tool to repair BGA chips, for example, baseband, CPU, etc. can have a multiplier effect with easy operation
• Using the best copper material after rolling, extruding, and drawing process
• Using good aluminum materials, rolling, polishing, and other processes,
• Breakthrough the traditional craftsmanship, the surface feels and internal hardness reach the best condition, light, and convenience.
• Carefully polished
• Pen-shaped design, breaking through the traditional polishing process.
• For mobile phone motherboards various small parts disassembly