Maant My-224-Or 10cc Bga Soldering Paste

Brand/Model: MAANT MY-224-OR
Volume: 10CC (cubic centimeters)
Type: BGA soldering paste
Use: Ideal for soldering Ball Grid Array (BGA) components
Flux: High-quality flux for effective cleaning and wetting
Viscosity: Optimized for precise application and staying in place during reflow
Applications: Used in electronics assembly, especially for fine-pitch soldering

₹119.00 ~~₹250.00~~

Maant My-224-Or 10cc Bga Soldering Paste

MAANT MY-224-OR (10CC) BGA Soldering Paste is a high-performance, lead-free solder paste designed for BGA (Ball Grid Array) and fine-pitch component soldering. It offers excellent printing, reflow, and tackiness properties, ensuring reliable solder joints. Ideal for high-precision applications in electronics manufacturing, it provides consistent, stable performance.

Feature	Details
Brand	Maant
Product Name	MY-224-OR BGA Soldering Paste
Volume	10CC
Color	Light Yellow (varies by batch)
Type	Lead-free BGA soldering paste
Suitable For	BGA (Ball Grid Array), fine-pitch components, electronics assembly
Drying Time	Non-drying, stable during reflow process
Finish After Drying	Smooth, reliable solder joints without hardening
Bottle/Tube Design	Easy-apply syringe for precise application
Non-Corrosive	Yes, safe for all electronic components
Durability	Excellent performance at high temperatures, long-lasting
Portability	Compact 10CC size, ideal for precision soldering tasks