Relife HW21S 183° Solder Paste

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Low melting point solder paste (183°C)
Ideal for SMD, BGA, and IC chip soldering
Smooth and consistent flow for precise work
Strong solder joints with minimal residue
Suitable for mobile and motherboard repair

Category: Relife

Relife HW21S 183° Solder Paste

Name: Relife HW21S 183° Solder Paste
SKU: 10325
Availability: InStock

1.Applicable to SMT patches, BGA welding, LED patches, etc.

2.Lead and silver have better conductivity?Improved conductivity and strength, optimized 183? medium temperature welding process, and protection of temperature sensitive components.

3.RELIFE’s solder paste has moderate humidity, solder paste is not easy to agglomerate, easy to tin, no false soldering.

4.No false solder joints, less residue, bright solder joints, strong solder creep, good conductivity, oxidation resistance, no corrosion to PCB, no need to clean.