Amtech NC-559-ASM Flux Paste 100gm

Amtech NC-559-ASM Flux Paste 100gm It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.

Features:

• 100% brand new high quality
• Made of high-quality materials for durability
• NC-559-ASM BGA Flux Solder Paste Flux 100g Flux.
• No-clean solder paste.
• Less residue, welding light, less smoke, no irritating odor.
• High viscosity no-clean fluxes can be used for rework, ball or lead attachment to BGA, CGA and CSP packages and assembly operations.
• For example, the flip chip is fixed on the PWB substrate, and the good formula of BGA ball/ball can make the ball fit better.

Product parameters:

• Model: NC-559-ASM
• Main ingredient: flux synthetic resin
• Color: yellow paste
• Melting point (C): 50
• Boiling point (C): 300
• Specification: 100g
• Scope of application: used for BGA, CSP and other ball array solder joint repair and ball replacement